Test method for exothermic temperature of encapsulating compounds for electronic and microelectronic encapsulation 电子元件及微电子元件封装用密封化合物发热温度测试方法
Standard test method for exothermic temperature of encapsulating compounds for electronic and microelectronic encapsulation 电子元件及微电子元件封装用密封化合物发热温度的标准试验方法
Test method for fluid and grease resistance of thermoset encapsulating compounds used in electronic and microelectronic applications 用于电子和微电子设备的热固性封装复合剂的耐液体和油脂的试验方法
Standard test method for fluid and grease resistance of thermoset encapsulating compounds used in electronic and microelectronic applications 电子和微电子学应用的热固性密封胶的耐流体和滑脂性能的标准试验方法
Low viscosity, excellent electrical properties, used extensively as a high voltage potting compound as well as an encapsulating compound for delicate circuitry, can be used with various curing agents, thus varying pot life, cure time, mix ratios and cure conditions 低粘度,有着出色的电气性能,广泛地应用为高压灌封化合物和精密电路密封化合物,可与多种催化剂使用,可改变灌胶时间、固化时间、混合比率以及固化条件。